Yo,
OK, a lot of stuff here and to be fair it's going to take several posts, likely over time, to work through this.
I thank you for posting such good images and I can clearly see your current enthusiasm and that you want to continue with this right now. So I'll try to explain my thoughts as "tasks" that will give us data and work us forward here.
1. In regards to the pictures, I only need (please just type it into a reply, don't try to photograph it) the "barely visible" lettering on the "transistor/mosfet looking" ICs. As you can see the coils are the large grey components whose component writing starts with "2R0LA", they have components next to them with 3 legs but the center leg cut off, in example regions labeled: E8F5 & F1E6. I need the text from those 3 leg (center-cut) ICs. Those areas look like DC generation (spot on). I can hopefully figure out where to measure voltage production (close to the source), if I can find the data sheet and all that.
2. In regards to your fallen-off capacitor. I’m worried it’s damaged, can you please use an ESR meter (if you have one) and a multimeter with a capacitor measurement function to try to verify its functional workings? Being physically knocked off with that much force, then re-heated over and over may have damaged it…you don’t want a damaged cap put back in for troubleshooting purposes…it may give you bad results and throw off your investigation. Please test it, though I would honestly prefer to order new caps with the same markings to install fresh on a new attempt. Get an SMD cap, not a through-via metal top cap, get a cap that looks like the old one.
3. Once you’re sure to have access to a known working cap to refit into the broken pad space you indicated now you can move forward. Let’s talk about exposing more copper trace. While I’d suggest you practice on another junk PCB until you get the hang of it. I recommend you make an amazon purchase of a nylon/fiberglass scratch pen:
https://www.amazon.com/dp/B003NHDITW/ref...2Eb13BFGFW
While you must be careful using this pen (for your breathing), this is what is commonly used to gently (but quickly) remove solder mask (green coating on the PCB board) through abrasive action. What you want to do is slowly remove the green masking on either (extreme-end) of the broken pad regions and you’ll hit copper from the two traces. Once you have clean copper you go no further! You can actually grind through the copper traces if you keep trying to sand with this pen (doesn’t happen instantly but don’t be aggressive). So what I expect to see is you’ll do a single line (repeated swiping of the pen) parallel to the white outline, travelling through the test point vias you tried to solder to. So the outline region where your old solder point and “+” are and the solder region where the “B7G4” text is. You’ll be uncovering more trace from that region. It should be very obvious once you see it that it’s where your broken pads were connected.
You need clean copper, but do two small areas and don’t hurry.
**HEALTH ISSUES** whether you get a nylon-based pen, or a genuine fiberglass pen isn’t an issue. But shedding fine fiber will occur with EVERY STROKE. That’s normal, you’ll need to blow them away and NEVER breath in from the site. I recommend extreme caution, you can run a desk fan on high, close to your breathing area, to push as much air at you as is reasonable to make sure that shedding fiber to being push away from you as you work. You don’t want to breath it in, if you want to try to wear a mask, fine. I’ve only done a little bit of this and never worn a mask...but I’ve always made sure the “fiber dust” that the pen produces is ejected mechanically and with air while I’m working…safety first!
4. Once you have good, usable areas of copper exposed at either end, you’ll need to try to pre-tin them. Remember, just like duct tape, solder likes to stick to solder. So, don’t try to take the cap and just solder it to the new copper. You’ll need to focus on successfully applying solder to the newly exposed copper areas. That will be difficult, but once you do it, then you just have to do a solder-to-solder joint…which is much easier.
5. I have a few different ideas on doing this, but I’ll pick an unorthodox one that should make is easier for someone starting out doing a board like this. For ease of this, I think it might be better to approach this by NOT putting the cap back the way it was (very difficult and will require pad material to attach Cap leads to new copper areas. I might have to draw out this idea to best describe it.
Before the start, you want to get two 3 inch lengths of wire, I’m unsure what gauge we really need but I’d say the larger the better to be safe, let’s say obviously not bigger than the copper traces you’ll be uncovering, so maybe like 20awg or around there? If you have like old 18awg wiring from a lighting fixture install or something, that might work as well. Just looking for easily workable wire that can carry let’s say 4 amps? Feel it out. Strip the ends about 2/8 inch and pre-tin the leads on both wires correctly (flux then solder) first.
But to try to put it into words, you need to preheat the board because the reason you have issues soldering so far is the board is mass of copper, the heat from your soldering iron is being take away and diffused throughout the copper layers. You may need a helper for this idea. The board really only needs to get to like 120F to help you, you want to take a fight out of this heatsink problem. You can use a heat gun or hair drier set on high and try to evenly heat the board from like 7 inches above it. I don’t mean concentrate heat on one spot…that won’t work and you’ll burn things. Patently, wave the heat gun around the entire board 7 inches or higher from it, just spend 20-30 minutes waving, tracing, moving, all around. You’re warming the board like you’re trying to melt an open-faced sandwich (evenly and slowly).
The board will get just into the “uncomfortable to hold/touch” situation. That should mean you’ve reached the right temperature! No solder should melt anywhere…you shouldn’t be near that kind of temperature. Just a little uncomfortable to hold in your hand or touch…little too hot to hold it.
Now that the board’s warmed up (quickly, before it cools down) stop heating it and set that heat gun aside, you want to use paste or liquid flux and quickly apply it to the “newly exposed” copper trace areas you uncovered with the abrasive pen, then attempt to get a nice, thin layer of solder on it with your iron set HOT, like 750F or maybe even higher…not a huge blob, just a nice little hump/hill on both exposed areas.
If you manage to get a nice little hill of solder successfully on both pads, then comes the kind of crazy idea (mine) part. I want you to now use your soldering iron and attach the each of the pre-tinned wires (one end on each wire) to the pads (one wire to one pad). So in the end you have the empty pad, with two short (perhaps already in a semi-circular shape) wires, laying on their sides (like IC legs) across your soldering region curving upwards. Think upside-down dead bug legs. Each wire curving upwards, pre-tinned leads are laying on the pads. You want as much pad to wire contact you can get. So lay the wire lead across the pre-tined copper pad in the best orientation that makes the most contact.
Reheat the joint and solder the wire lead to the pre-tinned pad area. Due to the board pre-heating the solder may not cool fast enough and the wire may fall or move if you let it go after soldering. So be prepared to hold the wire in place with pliers or something for like about 5-7 minutes at most as the board is cooling, eventually it should solidify and you’ll have two wires coming out of your pad regions (one at “+” area and one around the “B7G4” area).
6. Take a break, let the board cool to room temp, get a sandwich or call it a day and do this next step the next day.
7. I think you should install the cap UPSIDE DOWN, that is like a magician pulling a rabbit out of a hat, place the top of the SMD cap on the PCB, with its legs in the air, then you can flux, pre-tin the cap legs, then solder each of your wires to the legs *watch polarity (orientation and polarity must match…so + wire to + cap side).
And you’re done. You can slightly silicone epoxy the cap’s top to the PCB if you want, I’d go very light on any adhesive. Don’t use hot glue or crazy glue, they can deform plastics when curing and shrink which put stress on the cap and board.
Now you have it, you didn’t have to reheat the board and focus on it so hard that you risked burning or ruining other components, you have a very good connection with your little 3” wires. You can trim them or bend them (gently) or whatever to connect to the new cap. Attach the wire leads to the cap and you’re done. Now you COULD lay the cap on it’s side, or some other orientation if you want, whatever you can get to fit on the board.
This should hopefully be the easiest way to work on this board. All the heating and caution is very real, so don’t try to do a blind SMD cap hot air solder to it…chances aren’t in your favor. I suggest trying my wire lead idea, then you can attach the wire leads in another step without reheating the board.
Anyway, that’s what I’d try. It just has to look neat and well done, you don’t have to place components back in the same spots…just the same connection points.
Let us know how you end up.
In terms of the voltage fluxing, I don't think 3.28v is an issue. I'm unsure about 3.22v, the fact that it's wiggling highly suggests a filtering cap isn't working well anymore. As that's a good symptom of not doing it's job. If you get me the IC text I asked for above I can hopefully point you to the other voltage generation areas to probe to see if you see the same wiggling. I suspect the caps in those areas are the real issue (e.g. F2F1, F2E2, H0E9, H6E9).
Thanks,