[weblacky]

Yeah, I knew about the interleaved memory because I re-read the manual so I wouldn't be wrong...though I hate how SGI documents refer to BANK as a pair of DIMMs while the Firmware refers to bank as a single DIMM slot!!!

But it's obvious that there is a shorted or perhaps open bus line on two line between the two slots (the patterns show a..pattern of disruption) so it's definitely not random and my gut says THAT open or short of the bus lines IS the reason you get an XBOW error! If I can repair that, everything should clear!

I'm not going to do the CAC erase stuff now because I already did that and I KNOW the error will come right back until the condition is actually fixed. But I think it's either a cracked solder joint, shavings/blockage DIMM slot or some track issues...I'd have a hard time seeing a BGA issue with the Bedrock...so I assume the pads for bedrock ASIC are soldered well and connect...just the tracks are open or otherwise bridged.

I've just ordered the pricey (large) snaphats and I KNOW the L1 time is accurate enough (within minutes correct when I got it...so I KNOW the L1 RTC is still good. Must be the snaphat!

Then I'll remove the mainboard again inspect for this Memory BS, then if that works loading and stress-test, if that works...I'll dare to try my "fixed" V10 and see if it's actually fixed! The voltage drop load of both the old and new V10 cards appears the same in ENV...so it's still possible the old card's short was just a decoupling cap and might fire right up after the console issues are cleared.


Wish me luck and fingers crossed!