[jan-jaap]

There are no BGAs in this generation. Mostly through-hole with the odd SMD. Could still be cold soldering joints of course.

I have long suspected that similar problems in later generations (Reality Engines) have a root cause in the fact that the boards are relatively flexible, but they are littered with large surface mounted QFP chips. That's a recipe for cracked joints and lifted legs. Later boards (Infinite Reality) are much more rigid.